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4 Layer Half Hole Bluetooth Module Fr4 Circuit Board With Exposure Gold Of Antenna

Categories Fr4 PCB
Brand Name: XCEPCB
Model Number: XCEF-A
Certification: SGS,ISO9001,UL
Place of Origin: China
MOQ: 1 pcs
Price: USD0.1-100
Payment Terms: Western Union,, T/T
Supply Ability: 1000000PCS/M
Delivery Time: 3-12 WDS
Packaging Details: inner bubble pack, outer carton box
Material: Kingboard FR4
Color: blue
Technology: Hole ENIG
Product: bluetooth module
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4 Layer Half Hole Bluetooth Module Fr4 Circuit Board With Exposure Gold Of Antenna

FR4 4 Layer Half Bluetooth Module With Exposure Gold Of Antenna


Layer:4Material:FR4
Copper THK:1OZBoard THK:0.8mm
Finish: ENIGOrigin: China

Bluetooth module, is an integrated Bluetooth PCB board for short-distance wireless communication, Bluetooth data modules are divided into functions and Bluetooth voice module.


1DescriptionPCB Specification
2MaterialFR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminum
3Layer1-20
4Board Thickness0.2mm- 4.0mm
5Board Thickness Tolerance+/-10%
6Copper thickness17.5um-175um (0.5oz-5oz)
7Min Trace Width0.15mm
8Min Space Width0.15mm
9Min Drilling Dia0.2mm
10PTH copper thickness0.4-2mil(10-50um)
11Tolerance of Etching±1mil(±25um)
12V-cut angle25°,30°,45°,60°
13Pearl Strength of line≥ 6lb/in(≥ 107g/mm)
14Impedance control and tolerance50Ω±10%
15Twist&Wrap≤ 0.5%
16SoldermaskGreen, Red, Blue, White, Black, Yellow
17Surface Finish/PlatingHASL/Lead Free HASL/OSP/Gold Plating/Immersion Gold/ENIG
18CertificateROSH. ISO9001, UL Certificate
19FileProtel 99se/P-CAD/Autocad/Cam350
20Inner packingVacuum packing,Plastic bag
21Outer packingStandard carton packing


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