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Multilayer Flexible PCB Built on Polyimide With Immersion Gold and Green Solder Mask for Wireless Intercom

Categories Flexible PCB Board
Brand Name: Bicheng
Model Number: BIC-293.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: Polyimide
Layer count: 4 Layers
PCB thickness: 0.2mm
PCB size: 70.58 X 120.37mm
Coverlay: Yellow coverlay / Green solder mask
Silkscreen: White
Copper weight: 1oz
Surface finish: Immersion gold
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Multilayer Flexible PCB Built on Polyimide With Immersion Gold and Green Solder Mask for Wireless Intercom


Multilayer Flexible PCB Built on Polyimide With Immersion Gold and Green Solder Mask for Wireless Intercom

(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)


General description

This is a type of 4 layer flexible printed circuit for the application of Wireless Intercom at 0.2mm thick. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data.


Parameter and data sheet

Size of Flexible PCB70.58 X 120.37mm
Number of Layers4
Board TypeFlexible PCB
Board Thickness0.20mm
Board MaterialPolyimide 25µm
Board Material SupplierITEQ
Tg Value of Board Material60℃
PTH Cu thickness≥20 µm
Inner Iayer Cu thicknes35 µm
Surface Cu thickness35 µm
Coverlay ColourYellow coverlay / Green solder mask
Number of Coverlay2
Thickness of Coverlay25 µm
Stiffener Materialno
Stiffener ThicknessN/A
Type of Silkscreen InkIJR-4000 MW300
Supplier of SilkscreenTAIYO
Color of SilkscreenWhite
Number of Silkscreen1
Peeling test of CoverlayNo peelable
Legend Adhesion3M 90℃ No peeling after Min. 3 times test
Surface FinishImmersion Gold
Thickness of Nickle/GoldAu: 0.03µm(Min.); Ni 2-4µm
RoHS RequiredYes
Famability94-V0
Thermal Shock TestPass, -25℃±125℃, 1000 cycles.
Thermal StressPass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Function100% Pass electrical test
WorkmanshipCompliance with IPC-A-600H & IPC-6013C Class 2


Features and benefits

Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

Controllability of electrical parameter design

The end can be whole soldered

Continuity of processing

Provide small quantity, prototypes and production.

Engineering design prevents problems from occurring in pre-production.


Applications

Touch screen, consumer card reader soft board, tablet keypad flex board


Components of a flexible circuit

A flexible circuit consists of copper foil, dielectric substrate+ coverlay and adhesive.

Copper foil is available in two different types of copper: ED Copper and RA copper.


ED copper is an electro-deposited (ED) copper foil produced in the same way as the copper foil used for rigid printed circuit boards. This also means that the copper is “treated”, i.e., it has a slightly rough surface on one side, which ensures a better adhesion when the copper foil is bonded to the base material.

RA copper is a rolled and annealed copper foil produced from electrolytically deposited cathode copper, which is melted and cast into ingots. The ingots are first hot-rolled to a certain size and milled on all surfaces. The copper is then cold-rolled and annealed, until the desired thickness is obtained.

Copper foil is available in thickness of 12, 18, 35 and 70 μm.


The most common available for dielectric substrate and coverlay is polyimide films. This material can also be used as coverlay. Polyimide is best suited for flexible circuits because of its characteristics as stated below:

High temperature resistance allows soldering operations without damaging the flexible circuits

Very good electrical properties

Good chemical resistance

Polyimide is available in thicknesses of 12.5, 20, 25 and 50 μm.


Base laminates for rigid printed circuit boards are copper foils laminated together with the base materials, the adhesive coming from the prepreg material during lamination. Contrary to this is the flexible circuit where the lamination of the copper foil to the film material is achieved by means of an adhesive system. It is necessary to distinguish between two main systems of adhesive, namely thermoplastic and thermoset adhesives. The choice is dictated partly by the processing, and partly by the application of the finished flexible circuit.



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