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Categories | PCB Assembly Service |
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Brand Name: | FASTPCBA |
Model Number: | PCB Assembly |
Certification: | IATF16949, ISO13485, ISO9001 |
Place of Origin: | China |
MOQ: | 1pcs |
Price: | 1-20 |
Payment Terms: | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
Supply Ability: | 150000 Pieces per Month |
Delivery Time: | 5 |
Packaging Details: | PCB: Vacuum Packing/ PCBA: ESD Packing |
Laminate materials: | FR4, High TG FR4, High Frequency, Alum, FPC |
Number of layers: | 1-48 |
Board Thickness: | Single/Double:0.008±0.004” |
Max size of finish board: | 700*460mm |
Surface Finish: | HASL,ENIG,immersion silver,immersion tin,OSP… |
PCB outline: | Square,circle,irregular(with jigs) |
Capable
FASTPCBA offers one-stop service from PCB designing, manufacturing,
assembling, components soucing,programming to testing.
Confidential and Nondisclosure Agreement
We protect the Intellectual Property for our customers in the whole
process. Our staff of trained professionals are all working under a
strict confidentiality contract and keep[ the business secrets.
Flexibility
Customers-oriented. We forever center on customers’ demands,
constantly update and introduce into technology, fully understand
customers’ requirements and offer our professional suggestion.
PCBA Capability:
Item | PCB Assembly Service | |
1.Base Material | FR-4 / High TG FR-4 / Lead free Materials (ROHS Compliant) / Halogen Free material /CEM-3/CEM-1/ /PTFE/ROGERS/ARLON/TACONIC | |
2.Layers | 1-48 | |
3.Finised inner/outer copper thickness | 1-6OZ | |
4.Finished board thickness | 0.2-7.0mm | |
Tolerance | Board thickness≤1.0mm: +/-0.1mm 1<Board thickness≤2.0mm: +/-10% Board thickness>2.0mm: +/-8% | |
5.Max panel size | ≤2sidesPCB: 600*1500mm Multilayer PCB: 500*1200mm | |
6.Min conductor line width/spacing | Inner layers: ≥3/3mil Outer layers: ≥3.5/3.5mil | |
7.Min hole size | Mechanical hole: 0.15mm Laser hole: 0.1mm | |
Drilling precision: first drilling | First drilling: 1mil Second drilling: 4mil | |
8.Warpage | Board thickness≤0.79mm: β≤1.0% 0.80≤Board thickness≤2.4mm: β≤0.7% Board thickness≥2.5mm: β≤0.5% | |
9.Controlled Impedance | +/-5% | |
10. Aspect Ratio | 15:1 | |
11.Min welding ring | 4mil | |
12.Min solder mask bridge | ≥0.08mm | |
13.Plugging vias capability | 0.2-0.8mm | |
14. Hole tolerance | PTH: +/-3mil NPTH: +/-2mil | |
15.Outline profile | Rout/ V-cut/ Bridge/ Stamp hole | |
16.Surface treatment | OSP: 0.5-0.5um HASL: 2-40um Lead free HASL: 2-40um ENIG: Au 1-10U’’ ENEPIG: PB 2-5U’’/ Au 1-8U’’ Immersion Tin:0.8-1.2um Immersion silver: 0.1-1.2um Peelable blue mask Carbon ink Gold plating: Au 1-150U’’ | |
17. E-testing pass percent | 97% pass for the first time,+/-2%(tolerance) | |
FQC-Physical Lab: Reliability tests | ||
18.Certificate | IATF16949, ISO13485, ISO9001 |
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