Sign In | Join Free | My adobecards.com
adobecards.com
Products
Search by Category
Home > Other Electronic Components >

Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials

Categories Hermetic Packages Electronics
Brand Name: JBNR
Model Number: 50WCu,60WCu,70WCu,85WCu
Place of Origin: CHINA
MOQ: Negotiation
Price: Negotiable
Payment Terms: L/C, , T/T, Western Union
Supply Ability: 1000000pcs per month
Delivery Time: 25days
Packaging Details: as customer required
Material: tungsten copper
Density: 16.4
CTE: 7.2
TC: 180-190
Brand: JBNR
Application: Electronic Packaging
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
  • Submit Buying Request
    • Product Details
    • Company Profile

    Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials


    Copper Tungsten (WCu/CuW) / Molybdenum Copper (MoCu/CuMo) / Copper Molybdenum Electronic Packaging Materials

    Description:

    Copper Tungsten are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.
    Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable coefficient of thermal expansion and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper.Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.


    Advantages:
    1. High thermal conductivity
    2. Excellent hermeticity
    3. Stampable sheets available
    4. Semi-finished or finished (Ni/Au/Ag/NiPd/Au plated) products available
    5. Low void

    Product Properties:

    GradeW ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    90WCu90±2%17.06.5180 (25℃) /176 (100℃)
    85WCu85±2%16.47.2190 (25℃) / 183 (100℃)
    80WCu80±2%15.658.3200 (25℃) / 197 (100℃)
    75WCu75±2%14.99.0230 (25℃) / 220 (100℃)
    50WCu50±2%12.212.5340 (25℃) / 310 (100℃)

    GradeMo ContentDensity g/cm3

    Coefficient of thermal

    Expansion ×10-6 (20℃)

    Thermal conductivity W/(M·K)
    85MoCu85±2%10.07160(25℃)/156(100℃)
    70MoCu70±2%9.87200(25℃)/196(100℃)
    60MoCu60±2%9.667.5222(25℃)/217(100℃)
    50MoCu50±2%9.510.2250(25℃)/220(100℃)

    Application:

    Our products are widely used in applications such as heat sink, heat spreader, shim, laser diode submount, substrates, base plate, flange, chip carrier, optical bench, etc.

    Product picture:

    Quality Copper Tungsten WCu / CuW Molybdenum Copper MoCu / CuMo Electronic Packaging Materials for sale
    Send your message to this supplier
     
    *From:
    *To: Zhuzhou Jiabang Refractory Metal Co., Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)
     
    Inquiry Cart 0